With the new flow E1 modules Vincotech has added innovated features like the successfully field proven flow package technology with the pre-bent DCB.

flow E1 packages have been designed to offer an excellent thermal contact to the heat sink. This goal have been achieved successfully as can been seen in the pressure distribution investigation on a flat heat sink between competition on the left.

Housing dimensions

• Height: 12 mm
• Width: 63 mm
• Depth: 35 mm

Features

• 12 mm low-inductive standard industrial package
• Convex shaped substrate for superior thermal contact
• Compact design
• CTI600 housing material
• Thermo-mechanical push-and-pull force relief
• Pre-bent DCB for excellent thermal contact to heat sink
• Press-fit pins with stress-relive zone
• Optional Phase-change material

Benefits

• Superior thermal performance with 25% lower Rth compered to competition for higher reliability and higher power output
• Multiple source on chip level with the new IGBT M7 enables a secure supply of chips

Convex DCB for optimal thermal contact to the heat sink