flow S3 – the baseplate-less, medium-power package
The novel baseplate-less housing flow S3 comprises 67% more ceramic area than flow 1. Together with the low thermal resistance, flow S3 enables higher power density and more compact designs. Low inductivity is ensured by low profile 12 mm package, free pin positioning and the possibility to integrate ceramic capacitors.
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Learn more about flow S3 housing.
Main Benefits
- More power, same footprint
Superior thermal performance - Compact, lightweight designs
A low-inductive housing built for higher switching frequencies - Smaller price tag
No copper baseplate - Lower production cost
Press-fit pins and pre-applied TIM
General Features
- CTI600 housing material
- 12 mm low-inductive housing
- Fast, easy assembly
- Press-fit pins with stress-relief zone
- Pre-applied phase-change material
- Advanced die attach technology
Applications
Solar, Industrial Drives, Charging Stations, UPS