flow E3BP
109.6 mm x 59.7 mm
Possible features
- Cu baseplate
- Convex shaped baseplate for superior thermal contact
- CTI600 housing material
- Baseplate with rough surface
- Press-fit pin
- Reliable cold welding connection
- Thermo-mechanical push-and-pull force relief
- Topology
- Sub-Topology
-
Product line
-
Voltage
in V -
Current
in A -
Main Chip technology
-
Height
in mm
| Part-no details / Part-no datasheet | Product status | Topology | Sub-Topology | Product line | Voltage in V |
Current in A |
Main Chip technology | Housing family | Height in mm |
Isolation | Simulation |
|---|