Housing features
- Industry standard low-profile package
- Improved thermal impedance
- High thermal and power cycling capability
The new IMB (Insulated Metal Baseplate) combines an electrically insulating resin layer with a direct-bonded top- and bottom-side copper layer. Direct potting resin distributes the mechanical stress more uniformly than silicone gel.
![Comparison SLC with conventional technology](/fileadmin/user_upload/content_media/_processedbee_/b/e/csm_Comparison_SLC_with_conventional_technology_2080px_e56900994a.png)
![3D Preview 3D Preview](/fileadmin/user_upload/content_media/_processedbee_/0/b/csm_Products18_VINcoE3-21MT-L750-01-3D_22d2d6d741.jpg)
Outline drawing
![VINco E3](/fileadmin/user_upload/content_media/_processedbee_/9/c/csm_vincoe3-21m-01-2.1_ffe84a7238.jpg)