VINcoPRESS TECHNOLOGY The novel power module packaging technology presses the entire substrate to the heatsink, directly and evenly. VINcoPRESS TECHNOLOGY Substrate Material The substrate material provides electrical isolation between the semiconductors inside a power module and the heat sink. Aluminum nitride Silicon nitride Die Attach Technology The die-attach provides mechanical and electrical connection from semiconductor to DCB. Advanced Die-Attach Technology Thermal Interface Thermal Interface Material (TIM) is mandatory bond between the power module and the heat sink to improve the thermal performance and the reliability of the application. Pre-Applied Phase-change material Pre-Applied Thermal GREASE THERMAL GREASE PATTERN PROTECTION OF THERMAL INTERFACE MATERIAL - PROCAP Electrical Interface The electrical connection between a power module and the PCB can be done with usual pins to solder, Press-fit pins or spring terminals. Press-fit Technology Press-in Tools Advanced Semiconductor Technologies Power module solutions providing the best combination of semiconductors available on the market. Advanced Semiconductor Technologies
