Silicon nitride

Remarkable mechanical strength, superior toughness, and high thermal conductivity make silicon nitride substrates the material of choice for power modules designed for ultra reliable products.

Features

• High thermal conductivity (four times that of Al₂O₃)
• 50 % lower R_th for MiniSKiiP® (incl. thermal interface material)
• Physically robust enough for high-performance thermal interface material
• Phase-change with 3.4 W/mK to be used to expedite module assembly and handling
• Lower thermal expansion rates for improved load power cycling capability

Related Documents:

MiniSKiiP® with a Si₃N₄ AMB Substrate