Vincotech's MiniSKiiP® product family just got bigger. Now, new MiniSKiiP® modules with SIXPACK topology and extended power range are available for industrial and embedded drive applications.
As a true dual-source provider, we offer you a choice of semiconductors, the standard Trench IGBT4 and now the new Mitsubishi Electric gen 7 chip. Either way, these new MiniSKiiP® PACK 2 + MiniSKiiP® PACK 3 modules are the real deal.
MiniSKiiP® EXTENDED POWER
Main Features
- Superior EMI behavior cuts overall system costs
- 20 % lower static losses than competing products
- Power range extended up to 200 A for flexible, scalable inverter designs
- Available with various pre-applied thermal grease
Target application
- Drives
MiniSKiiP® PACK 2 & 3
Comparison of IGBT M7 chips with competition
With the benefit of Mitsubishi Electric gen 7 chip technology, our new MiniSkiiP® PACK modules leave a smaller chip footprint than competing products. They also provide an extended power range (up to 200 A in MiniSkiiP® PACK 3) in the same-size package to achieve the kind of scaling that slashes costs.
MiniSKiiP® PACK 2 & 3 power range
MiniSKiiP® PACK 2 & 3 - overview:
| Product Family | Part-No. | Voltage in V | Current in A | Comment |
|---|---|---|---|---|
| MiniSKiiP® PACK 2 | 80-M2126PA050M7-K718F70 | 1200 | 50 | under development |
| MiniSKiiP® PACK 2 | 80-M2126PA075M7-K719F70 | 1200 | 75 | in qualification |
| MiniSKiiP® PACK 2 | 80-M2126PA100M7-K710F70 | 1200 | 100 | in qualification |
| MiniSKiiP® PACK 3 | 80-M3126PA100M7-K828F70 | 1200 | 100 | in qualification |
| MiniSKiiP® PACK 3 | 80-M3126PA150M7-K829F70 | 1200 | 150 | in qualification |
| MiniSKiiP® PACK 3 | 80-M3126PA200M7-K820F70 | 1200 | 200 | in qualification |
Samples of the MiniSKiiP® PACK 2 & 3 modules may be sourced on demand from our usual channels.
Press Release
- PR-16-05_VINco-E3-new-mid-power-package.pdf – PDF, 135 KB