flow 1C
72 mm x 52 mm
Possible features
- Ceramic substrate for Thick-film based designs
- Convex shaped substrate for superior thermal contact
- Thermo-mechanical push-and-pull force relief
- Solder pin
- Topology
- Sub-Topology
-
Product line
-
Voltage
in V -
Current
in A -
Main Chip technology
-
Height
in mm
| Part-no details / Part-no datasheet | Product status | Topology | Sub-Topology | Product line | Voltage in V |
Current in A |
Main Chip technology | Housing family | Height in mm |
Isolation | Simulation |
|---|